This application note describe Printed Circuit Board (PCB) design considerations for the MKW2x LGA63 package. Included are layouts of the component copper layer, solder
Hardware Design Considerations for MKW2x IEEE 802.15.4 Devices
This application note describe Printed Circuit Board (PCB) design considerations for the MKW2x LGA63 package. Included are layouts of the component copper layer, solder
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