OL-NX5P2190 WL CS P9 OL-NX5P2190 wafer level chip-scale package; 9 bumps; body 1.36 x 1.36 x 0.51 mm (Backside coating included) 8 February 2016 Package information 1. Package summary Terminal
OL-NX5P2190 WL CS P9 OL-NX5P2190 wafer level chip-scale package; 9 bumps; body 1.36 x 1.36 x 0.51 mm (Backside coating included) 8 February 2016 Package information 1. Package summary Terminal
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