OL-NX5P1100 WL CS P1 2 OL-NX5P1100 WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 8 February 2016 Package information 1. Package
OL-NX5P1100 WL CS P1 2 OL-NX5P1100 WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 8 February 2016 Package information 1. Package
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