SOT1459-3 WL CS P4 2 SOT1459-3 wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.525 mm 13 May 2016 Package information 1. Package summary Terminal position code B (bottom) Package type
SOT1459-3 WL CS P4 2 SOT1459-3 wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.525 mm 13 May 2016 Package information 1. Package summary Terminal position code B (bottom) Package type
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