wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.94 mm x 2.59 mm x 0.415 mm body (backside coating included) SOT1890-1 wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.94 mm x
wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.94 mm x 2.59 mm x 0.415 mm body (backside coating included) SOT1890-1 wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.94 mm x
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