SOT1445-2 SOT1445-2 6 December 2016 Package information 1. Package summary Terminal position code B (bottom) Package type
wafer level chip-scale package; 6 bumps; 0.69 mm x 0.44 mm x 0.29 mm
SOT1445-2 SOT1445-2 6 December 2016 Package information 1. Package summary Terminal position code B (bottom) Package type