SOT1390-7 WLCSP12, wafer level chip-scale package; 12 bumps; 1.67 mm x 1.27 mm x 0.525 mm
SOT1390-7 WLCSP12, wafer level chip-scale package; 12 bumps; 1.67 mm x 1.27 mm x 0.525 mm
05/29 18:59
01/22 09:54
01/22 09:50
01/22 09:27
01/22 09:24
01/22 09:21
01/16 10:43
01/10 14:26
01/09 18:37
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01/05 14:15
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