SOT1887-3 SOT1887-3 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 10 January 2018 Package information 1. Package summary Terminal position code B
SOT1887-3 SOT1887-3 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 10 January 2018 Package information 1. Package summary Terminal position code B
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