SOT1444-5 WL CS P49 SOT1444-5 WLCSP49, wafer level chip-scale package; 49 bumps; 3.44 mm x 3.44 mm x 0.525 mm (Backside coating included) 9 April 2018 Package information 1. Package summary Terminal
SOT1444-5 WL CS P49 SOT1444-5 WLCSP49, wafer level chip-scale package; 49 bumps; 3.44 mm x 3.44 mm x 0.525 mm (Backside coating included) 9 April 2018 Package information 1. Package summary Terminal
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