WLCSP64, wafer level chip-scale package; 64 bumps; 3.24 mm x 3.24 mm x 0.625 mm body (backside coating included) SOT1782-3 WLCSP64, wafer level chip-scale package; 64 bumps; 3.24 mm x 3.24 mm x 0.625
WLCSP64, wafer level chip-scale package; 64 bumps; 3.24 mm x 3.24 mm x 0.625 mm body (backside coating included) SOT1782-3 WLCSP64, wafer level chip-scale package; 64 bumps; 3.24 mm x 3.24 mm x 0.625
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