wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside coating included) SOT1384-5 wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside
wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside coating included) SOT1384-5 wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside
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