BGA测试插座,BGA Socket

lingmei-121304

www.lingmei.com.cn

产品特点:

   

•     Any package style: ceramic & plastic BGA, CSP, LGA, CGA, PSGA, MLF/QFN,QFP, SOIC, and other standard packages, custom packages or bare die
     
  
•     Inductance: less than 2nH
     
  
•     -1dB bandwidth: >14GHz for compression style; 3GHz for SMD style
     
  
•     available for any chip size and grid pattern
     
  
•     Same PCB layout as the IC (no holes required for SMD socket)
     
  
•     Minimal keepout area of 6mm beyond the IC’s periphery
     
  
•     Raised SMD style for lifting socket over adjacent components
     
  
•     Low profile socket (standard Twist Lock is less than 10mm high with IC)
     
  
•     Contact force: max 40 grams per contact; lower forces available
     
  
•     Semi-custom design = lower cost and tailored to your needs
  

Twist Lock	Fast Lock	Clamshell
Elastomer sockets	Knob Lock	Solderless Compression Type
Quick Lock	QFN / MLF / MLP Socket	Sockets with SMT solderball adapters
ZIF Lever Lock	QFP/PQFP/SOIC/SO etc	BGA Adapters