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印制电路板术语

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  • TA的每日心情
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    2015-2-13 10:50
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    [LV.6]常住居民II

    发表于 2009-6-12 10:11:46 | 显示全部楼层 |阅读模式
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    [size=67%]印制电路板
    [size=67%]Printed Circuit Board (PCB)
    [size=67%]印制线路板
    [size=67%]Printed Wiring Board (PWB)
    [size=67%]双面印制板
    [size=67%]Double-side Printed Board
    [size=67%]多层印制板
    [size=67%]Mulitlayer Printed Board
    [size=67%]高密度互连板
    [size=67%]HDI(High density interconnection)
    [size=67%]特性阻抗
    [size=67%]Characteristic impedance
    [size=67%]电子电路互连与封装协会
    [size=67%]IPC(The institute for Interconnecting and [size=67%]Packing Electronic Circuits)
    [size=67%]美国保险商实验所
    [size=67%]UL(Underwriters laboratories inc.)
    [size=67%]计算机辅助制造
    [size=67%]CAM(computer-aided manufacturing
    [size=75%]元件面
    [size=75%]Component side (C/S)
    [size=75%]焊接面
    [size=75%]Solder Side (S/S)
    [size=75%]文字
    [size=67%]Silkscreen/Legend/Component Mark
    [size=75%]防焊
    [size=75%]Solder Mask
    [size=75%]底片
    [size=75%]Artwork
    [size=67%]基准点/光标点/对光点
    [size=75%]Fiducial mark
    [size=75%]工具孔
    [size=75%]Tooling hole
    [size=75%]埋/肓孔
    [size=75%]Buried/Blind Via
    [size=75%]半径/直径
    [size=75%]Radius/Diameter
    [size=75%]尺寸公差
    [size=75%]Dimension tolerance
     [size=75%]导线
    [size=75%]Track/conductor
    [size=75%]线宽
    [size=75%]Line width
    [size=75%]线隙
    [size=75%]Spacing
    [size=75%]粉红圈
    [size=75%]Pink ring
    [size=75%]规格,规范
    [size=75%]Specification
    [size=75%]周期代码
    [size=75%]Date Code
    [size=75%]阻燃性等级
    [size=75%]Flammability Rate
    [size=75%]公司标识及UL标识
    [size=75%]Company Logo & UL Mark
    [size=75%]可靠性试验
    [size=75%]Reliability Tests
    [size=75%]统计过程控制
    [size=67%]Statistical Process Control (SPC)
     
    [size=75%]Carbon printing
    [size=75%]碳油印刷
    [size=75%]HAL(hot air leveling)
    [size=75%]喷锡
    [size=75%]Profiling
    [size=75%]成形
    [size=75%]Punching
    [size=75%]冲板
    [size=75%]Routing
    [size=75%]锣板
    [size=75%]V-cut
    [size=75%]V坑
    [size=75%]E-Test
    [size=75%]电性测试
    [size=75%]Peelable blue mask
    [size=75%]蓝胶
    [size=75%]OSP(Organic solderability 
    [size=75%]         preservative)

    [size=75%]有机保焊
     
    [size=75%]Physical Laboratory
    [size=75%]物理实验室
    [size=75%]Chemistry Laboratory
    [size=75%]化学实验室
    [size=75%]Solder mask
    [size=75%][size=75%]
    [size=75%]ENIG (Electroless nickel immersion   
    [size=75%]           gold)

    [size=75%]沉镍金
    [size=75%]Component mark
    [size=75%]字符
    [size=75%]WIP[size=75%][size=75%]work in process[size=75%]
    [size=75%]半成品
    [size=75%]F.G(Finished goods)
    [size=75%]成品
    [size=75%]Accept [size=75%](ACC)
    [size=75%]接收
    [size=75%]Reject[size=75%](REJ)
    [size=75%]拒收
     
    [size=75%] 
    <div v:shape="_x0000_s2068"><span style="font-size: 75%">[size=67%]Board cut[size=67%]
    [size=67%]开料[size=67%]
    [size=67%]Inner dry film[size=67%]
    [size=67%]内层干膜[size=67%]
    [size=67%]Inner etching[size=67%]
    [size=67%]内层蚀刻[size=67%]
    [size=67%]AOI (Automatic Optical Inspection)[size=67%]
    [size=67%]自动光学检测[size=67%]
    [size=67%]Pressing[size=67%]
    [size=67%]压板[size=67%]
    [size=67%]Drilling[size=67%]
    [size=67%]钻孔[size=67%]
    [size=67%]Desmear[size=67%]
    [size=67%]除胶渣,去钻污[size=67%]
    [size=67%]PTH[size=67%]
    [size=67%]镀通孔,沉铜[size=67%]
    [size=67%]Panel plating[size=67%]
    [size=67%]整板电镀[size=67%]
    [size=67%]Outer dry film[size=67%]
    [size=67%][size=67%]层干膜[size=67%]
    [size=67%]Etching[size=67%]
    [size=67%]蚀刻[size=67%]
    [size=67%]Tin stripping[size=67%]
    [size=67%]退锡[size=67%]
    [size=67%]EQC (QC after etching)[size=67%]
    [size=67%]蚀检[size=67%]QC[size=67%]
    [size=75%]FQC(final quality control)[size=75%]
    [size=75%]最终检查[size=75%]
    [size=75%]FQA(Final quality audit)[size=75%]
    [size=75%]最终抽检[size=75%]
    [size=75%]Packing[size=75%]
    [size=75%]包装[size=75%]
    [size=75%]IPQA(In-process quality audit)[size=75%]
    [size=75%]流程[size=75%]QA[size=75%]
    [size=75%]IPQC(In-process quality control)[size=75%]
    [size=75%]流程[size=75%]QC[size=75%]
    [size=75%]IQC(Incoming quality control)[size=75%]
    [size=75%]来料检查[size=75%]
    [size=75%]MRB(material review bill)[size=75%]
    [size=75%]材料评审委员会[size=75%]
    [size=75%]QA(Quality assurance)[size=75%]
    [size=75%]品质保证[size=75%]
    [size=75%]QC(Quality control)[size=75%]
    <div class="O" v:shape="_x0000_s2068"><strong><font size="2">[size=75%]品质控制
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    发表于 2009-7-4 10:54:24 | 显示全部楼层

    RE:印制电路板术语

    怎么看不清楚,字体问题吧?楼主。
    回复 支持 反对

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  • TA的每日心情
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    2015-2-13 10:50
  • 签到天数: 72 天

    连续签到: 1 天

    [LV.6]常住居民II

     楼主| 发表于 2009-7-7 10:33:56 | 显示全部楼层

    RE:印制电路板术语

    可能是字体问题,我再发一遍!
    印制电路板
    Printed Circuit Board (PCB)
    印制线路板
    Printed Wiring Board (PWB)
    双面印制板
    Double-side Printed Board
    多层印制板
    Mulitlayer Printed Board
    高密度互连板
    HDI(High density interconnection)
    特性阻抗
    Characteristic impedance
    电子电路互连与封装协会
    IPC(The institute for Interconnecting and Packing Electronic Circuits)
    美国保险商实验所
    UL(Underwriters laboratories inc.)
    计算机辅助制造
    CAM(computer-aided manufacturing
    元件面
    Component side (C/S)
    焊接面
    Solder Side (S/S)
    文字
    Silkscreen/Legend/Component Mark
    防焊
    Solder Mask
    底片
    Artwork
    基准点/光标点/对光点
    Fiducial mark
    工具孔
    Tooling hole
    埋/肓孔
    Buried/Blind Via
    半径/直径
    Radius/Diameter
    尺寸公差
    Dimension tolerance
    导线
    Track/conductor
    线宽
    Line width
    线隙
    Spacing
    粉红圈
    Pink ring
    规格,规范
    Specification
    周期代码
    Date Code
    阻燃性等级
    Flammability Rate
    公司标识及UL标识
    Company Logo & UL Mark
    可靠性试验
    Reliability Tests
    统计过程控制
    Statistical Process Control (SPC)

    Carbon printing
    碳油印刷
    HAL(hot air leveling)
    喷锡
    Profiling
    成形
    Punching
    冲板
    Routing
    锣板
    V-cut
    V坑
    E-Test
    电性测试
    Peelable blue mask
    蓝胶
    OSP(Organic solderability
             preservative)
    有机保焊

    Physical Laboratory
    物理实验室
    Chemistry Laboratory
    化学实验室
    Solder mask
    阻焊
    ENIG (Electroless nickel immersion   
               gold)
    沉镍金
    Component mark
    字符
    WIP(work in process)
    半成品
    F.G(Finished goods)
    成品
    Accept (ACC)
    接收
    Reject(REJ)
    拒收


    Board cut
    开料
    Inner dry film
    内层干膜
    Inner etching
    内层蚀刻
    AOI (Automatic Optical Inspection)
    自动光学检测
    Pressing
    压板
    Drilling
    钻孔
    Desmear
    除胶渣,去钻污
    PTH
    镀通孔,沉铜
    Panel plating
    整板电镀
    Outer dry film
    外层干膜
    Etching
    蚀刻
    Tin stripping
    退锡
    EQC (QC after etching)
    蚀检QC
    FQC(final quality control)
    最终检查
    FQA(Final quality audit)
    最终抽检
    Packing
    包装
    IPQA(In-process quality audit)
    流程QA
    IPQC(In-process quality control)
    流程QC
    IQC(Incoming quality control)
    来料检查
    MRB(material review bill)
    材料评审委员会
    QA(Quality assurance)
    品质保证
    QC(Quality control)
    品质控制
    回复 支持 反对

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    发表于 2009-7-7 15:53:42 | 显示全部楼层

    RE:印制电路板术语

    【PCB打样】双面板100元/款起(含测试)四层板500元/款起(含测试)李工 15817448851
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    回复 支持 反对

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