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from www.physorg.com
Nokia, STMicroelectronics close agreement in 3G chipset development
Nokia and STMicroelectronics today announced the closing of their deal,announced on August 8th, to deepen their collaboration on the licensingand supply of integrated circuit designs and modem technologies for 3Gand its evolution.
The closing of themultifaceted agreement transfers a core part of Nokia's IntegratedCircuit (IC) operations to STMicroelectronics and positions ST todesign and manufacture 3G chipsets based on Nokia's modem technologies,energy management and RF (radio frequency) technology and to delivercomplete solutions to Nokia and the open market.
The agreement includes the transfer of approximately 185highly-skilled engineers and other Nokia personnel in Finland and UK toSTMicroelectronics. The transfer has been subject to a personnelconsultation process required by local regulations
As part of the arrangement, Nokia has awarded ST a design [size=100%]win of an advanced 3G HSPA (high-speed packet access) chipset supporting high [size=100%]data rates. This design win represents ST's first complete 3G chipset. |
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发表于 2007-11-6 06:17:21
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