| Processor Family | CC = Embedded RF Radio
MSP = Mixed Signal Processor
XMS = Experimental Silicon
|
| 430 MCU Platform | TI’s Low Power Microcontroller Platform |
| Device Type | Memory Type
C = ROM
F = FLASH
FR = FRAM
G = FLASH (Value Line)
L = No Nonvolatile Memory
| Specialized Application
AFE = Analog Front End
BT = Pre-programmed with Bluetooth
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
|
|
| Series | 1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy OTP
4 Series = Up to 16 MHz w/ LCD
| 5 Series = Up to 25 MHz
6 Series = Up to 25 MHz w/ LCD
0 = Low Voltage Series
|
|
| Feature Set |
Various Levels of Integration within a Series
|
A = Revision optional
| N/A |
Temperature Range optional
| S = 0°C to 50°C
C = 0°C to 70°C
I = -40°C to 85°C
T = -40°C to 105°C
|
| Packaging | www.ti.com/packaging |
Tape and Reel optional
| T = Small Reel (7-in)
R = Large Reel (11-in)
No Markings = Tube or Tray
|
Additional Featuresoptional
| *-EP = Enhanced Product (-40°C to 105°C)
*-HT = Extreme Temperature Parts (-55°C to 150°C)
|
发表于 2013-8-14 18:18:14
/5 
