世界最小蓝牙4.0模块

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TDK SESUB-PAN-T2541蓝牙V4.0模块在4.6x5.6x1.0mm封装超小型低功耗蓝牙模块。所述SESUB-PAN-T2541是基于TDK的专有SESUB技术（半导体嵌入在衬底）并适合于在可穿戴设备的使用。蓝牙芯片嵌入到薄片基板连同石英谐振器，带通滤波器，和电容器。该模块仅需要电源和天线。蓝牙V4.0 LE规格显著减少电池供电设备的功耗，非常适合用于无线健康关怀，体育，健身，家庭娱乐和可穿戴设备。Features

       

• Micro size (4.6×5.6×1.0mm) ideal for wearable devices.       
  
• Communicable with Bluetooth® Smart Ready compatible devices.       
  
• Separate antenna type that provides more flexibility for product design.